Precision × Integration × Intelligence | From Precision Sheet Metal Fabrication to Smart Equipment, All in One Stop
The global semiconductor industry's annual grand event, SEMICON Taiwan 2026, is set to be held at the Taipei Nangang Exhibition Center. As a trusted partner in high-end equipment structures and precision manufacturing, Taiwan Fylin Industrial (TFI) will present under the theme "Together, Build the Future," showcasing our One-Stop Semiconductor Solution, which covers precision frame welding, modular mechanism assembly, high-end parts machining, and intelligent automated inspection.
Focusing on Strict Semiconductor-Grade Standards: Highlights of TFI’s 2026 Exhibition
With the rapid evolution of advanced manufacturing processes and high-end packaging technologies, requirements for structural rigidity, micron-level tolerances, and cleanroom assembly for semiconductor equipment have become increasingly stringent. Leveraging deep expertise in manufacturing processes and intelligent integration, Taiwan Fylin Industrial will highlight core manufacturing capabilities at this exhibition:
- Precision Frame Welding: High-rigidity welded frames custom-built for large-scale semiconductor and high-tech machinery, featuring stress-relief and precision machining technologies to ensure ultimate stability and vibration resistance during long-term equipment operation.
- Structure & Assembly: Providing high-spec cleanroom assembly, modular enclosure integration, and airtight protection processes to help customers significantly reduce sub-system assembly time and supply chain management costs.
- Smart Manufacturing: Fully implementing digital production management and process monitoring to provide global OEMs/ODMs with flexible, highly transparent, and timely contract manufacturing support.
Exhibition Information
- Exhibition Name: SEMICON Taiwan 2026
- Dates: September 2–4, 2026
- Location: TaiNEX 2, 1F, Taipei, Taiwan
- Booth Number: Q5937
